Samsung unveils plan to fast-track AI chip delivery

Samsung Electronics has announced that its contract manufacturing division will provide a streamlined service for producing AI chips faster by integrating its leading memory chip, foundry, and chip packaging services. This integration is designed to capitalize on the growing demand for AI technology.

By allowing clients to communicate through a single channel that coordinates Samsung’s memory chip, foundry, and packaging teams simultaneously, the time required to produce AI chips has been reduced by approximately 20%, according to Samsung’s announcement on Wednesday.

Siyoung Choi, president and general manager of Samsung’s foundry business, highlighted the transformative impact of generative AI on the technology landscape during an event in San Jose, California. Choi projected that the global chip industry revenue would increase to $778 billion by 2028, driven largely by AI chips.

Marco Chisari, Executive Vice President of Foundry Sales and Marketing, expressed confidence in the high demand for AI chips, echoing OpenAI CEO Sam Altman’s ambitious projections. Altman previously indicated a desire to build around three dozen new chip factories, as reported by Reuters.

Samsung is unique in offering memory chips, foundry services, and chip design under one roof, a combination that has sometimes been seen as a disadvantage due to potential conflicts of interest with clients. However, with the surge in demand for integrated AI chips that can process large amounts of data efficiently, Samsung believes its comprehensive approach will be advantageous.

The company also showcased its advanced chip architecture, gate all-around (GAA) transistors, which enhance chip performance and reduce power consumption. GAA is crucial for continuing to develop more powerful AI chips as they become increasingly miniaturized.

Although competitors like TSMC are also developing GAA-based chips, Samsung was an early adopter and plans to start mass production of its second-generation 3-nanometer chips using GAA technology in the latter half of this year.

Additionally, Samsung unveiled its latest 2-nanometer chipmaking process, aimed at high-performance computing chips, which improves power delivery by placing power rails on the backside of the wafer. Mass production of these chips is expected to begin in 2027.